The Smart Optical Sensors and Interfaces research unit (SOI) of the Center for Materials and Microsystems carries out R&D activities on advanced integrated imaging sensors.

The main focus of these activities is the miniaturization of complex and multi-source imaging systems using standard microelectronic fabrication processes. In 1993 the first smart CMOS camera has been published. Until today SOI have been developed more than 60 microchips.

The researchers of the group are able to start from the analytical study and modeling of the problem, the design of the circuit and the physical layout, to the chip test and demonstrator design. 

ASICs designed with state-of-the-art software tools are fabricated through multi-project wafers of full wafer production by various foundries around the world. The testing is performed in-house using dedicated laboratory equipment devoted to the peculiar aspects of the characterization of advanced imaging systems.

Dissemination of results is achieved with publication in international conferences and journals, and technological transfer is performed by tight collaboration with local and national industries.

• EXPERTISE

   - Research and Development of CMOS Advanced Image Sensors
   - Circuit and Device Design and Simulations
   - Design: 130nm-350nm CMOS Wafer and MPW
   - Electro Optical Testing and PCBs
   - EO Systems Prototyping